s1
s3
BHEL Global Tender for 156.75 mm diamond wire saw multi...
Home ›  Notice Board  ›  BHEL Global Tender for 156.75 mm diamond wire saw multi silicon wafer

BHEL Electronics division, Bangalore has invited tenders from reputed companies for supply of silicon wafers. Details as follows.

Sl. No.

Material

Ref No

Due Date

Details can be downloaded at

1.

156.75 mm diamond wire saw multi silicon wafer

MDSSCPV035

  09.07.2018

http://www.bhel.com/tender/view_tender.php?tenderid=39358

 

The tender details can be downloaded from www.bheledn.com  and  www.bhel.com.

 
 
© Consulate General of India, Vancouver, BC, Canada 2019. All Rights Reserved.
Terms & Condition| Privacy Policy| Copy right policy| Accessibility Statement| Help|
Page last updated on: Oct 23, 2019    Visitors: 1345178
Powered by: Ardhas Technology India Private Limited